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Frequency‐dependent maximum average power‐handling capabilities of single and edge‐coupled microstrip lines on low‐temperature co‐fired ceramic (LTCC) substrates
Author(s) -
Yin WenYan,
Dong Xiaoting,
Gan Y. B.
Publication year - 2006
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.20125
Subject(s) - microstrip , materials science , ceramic , microwave , attenuation , dielectric , enhanced data rates for gsm evolution , thermal conductivity , electrical conductor , optoelectronics , power (physics) , power density , wideband , electronic engineering , electrical engineering , composite material , engineering , optics , telecommunications , physics , quantum mechanics
The frequency‐dependent maximum average power‐handling capabilities (APHCs) of single and edge‐coupled microstrip lines (MLs) on low‐temperature co‐fired ceramic (LTCC) substrates are investigated in this article. Although LTCCs have excellent high‐frequency performance, the thermal conductivity is about 2.0–3.0 W/m°C, which is much smaller than that of sapphires, alumina, silicon, and GaAs. The method used to predict the APHC is based on the calculated conductive and dielectric attenuation constants for different modes, and the proposed multilayer thermal model for the temperature rise. Numerical investigations are carried out to examine the effects of geometric and physical parameters on the wideband pulse responses and maximum APHC for single finite‐ground thin‐film and coupled MLs, respectively. Methodologies to enhance the power‐handling capability which are useful in the design of high‐density microstrip interconnects on or embedded in multi‐layer LTCCs are proposed. © 2005 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2006.