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Benchmark of full Maxwell 3D electromagnetic field solvers on an SOIC8 packaged and interconnected circuit
Author(s) -
Vrancken M.,
Aerts W.,
Vandenbosch G.A.E.
Publication year - 2006
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.20119
Subject(s) - benchmark (surveying) , electromagnetic field solver , solver , interconnection , electromagnetic field , microwave , computer science , field (mathematics) , computational electromagnetics , maxwell's equations , electromagnetics , topology (electrical circuits) , electronic engineering , computational science , electrical engineering , engineering , physics , telecommunications , mathematics , mathematical analysis , optical field , geodesy , programming language , geography , inhomogeneous electromagnetic wave equation , quantum mechanics , pure mathematics
The MAGMAS3D full Maxwell electromagnetic field solver developed at Katholieke Universiteit. Leuven is benchmarked with several commercially available solvers in the analysis of a complete industry‐standard SOIC8 (single‐outline integrated circuit with eight leads) circuit, packaging, and interconnection topology. The benchmark deals with predicted results as well as computer speed and memory. The benchmark description and results should give practicing engineers valuable insights into (at least part of) the products on the present‐day full‐wave 3D EM simulation market. © 2005 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2006.