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Average power‐handling capability of the signal line in coplanar waveguides on polyimide and GaAs substrates including the irregular line edge shape effects
Author(s) -
Yin WenYan,
Zhang Yaojiang,
Dong Xiaoting,
Gan Yeow Beng
Publication year - 2005
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.20063
Subject(s) - polyimide , materials science , signal (programming language) , microwave , enhanced data rates for gsm evolution , line (geometry) , ohmic contact , thermal conductivity , optoelectronics , parametric statistics , coplanar waveguide , power (physics) , thermal , conductivity , layer (electronics) , electronic engineering , optics , composite material , telecommunications , physics , computer science , engineering , geometry , mathematics , quantum mechanics , programming language , statistics , meteorology
The average power‐handling capability (APHC) of the signal line in finite‐ground coplanar waveguides (FGCPWs) on polyimide and GaAs substrates is evaluated in this paper. In our approach, the ohmic loss of metal lines is characterized in different ways, and the effects of an irregular edge shape are also considered. The rise in temperature of the signal line is determined by single‐ and double‐layer thermal models, with the temperature‐dependent properties of the thermal conductivity of GaAs material treated appropriately. Parametric studies are carried out to investigate the overall effects of signal‐line width, thickness, conductivity, edge‐shape angle, and polyimide thickness on APHC. Some possible ways to enhance the APHC of these FGCPWs are also proposed. © 2005 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2005.