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Analysis for active integrated antenna arrays with 2D‐ and 3D‐printed EBGs
Author(s) -
Kawasaki Shigeo,
Sasaki Ryosuke,
Ishida Hideyuki
Publication year - 2004
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.20009
Subject(s) - finite difference time domain method , antenna (radio) , software , microwave , simulation software , electronic engineering , reflection (computer programming) , electronic circuit simulation , computer science , field (mathematics) , engineering , acoustics , electrical engineering , optics , physics , telecommunications , electronic circuit , mathematics , pure mathematics , programming language
Abstract A nonlinear circuit simulator and an electromagnetic simulator based on FDTD analysis are combined simultaneously to obtain circuit characteristics and field distribution for analysis of a 10‐GHz slot antenna with a printed electromagnetic band gap (EBG) structure and a 23‐GHz active integrated antenna (AIA) array. Experimentally, the printed EBG exhibits good performance in the active integrated antenna. The injection‐reflection matching method in the time domain via a data file, called the via‐file data‐matching technique, is proposed as a simulation technique to connect with different types of simulation as well as different analytical conditions. The results are compared with those obtained using commercial software packages. The characteristics obtained from the simulation agreed with the experimental data, and the field distribution created by the simulator can help us understand wave‐propagation behavior in the array. © 2004 Wiley Periodicals, Inc. Int J RF and Microwave CAE 14: 262–273, 2004.