Premium
Average power handling capability of multilayer microstrip lines
Author(s) -
Bahl Inder J.
Publication year - 2001
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/mmce.1046
Subject(s) - microstrip , microwave , materials science , amplifier , polyimide , substrate (aquarium) , power (physics) , electrical engineering , optoelectronics , electronic engineering , engineering , telecommunications , physics , composite material , layer (electronics) , cmos , quantum mechanics , oceanography , geology
This article describes the average power handling capability (APHC) of multilayer microstrip lines, including the effect of mismatch at the terminations. The data presented herein are validated by considering an example of a 12‐W monolithic microwave integrated circuit power amplifier fabricated using multilayer low‐loss microstrip technology. The calculated value of APHC for a 50‐Ω line of a 75‐μm‐thick GaAs substrate is 1445 W at 10 GHz, whereas the corresponding value for a multilayer microstrip that has 10‐μm‐thick polyimide is only 44 W. At 40 GHz, these values are reduced by a factor of 2. © 2001 John Wiley & Sons, Inc. Int J RF and Microwave CAE 11: 385–395, 2001.