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High‐performance Cu/Al laminated composites fabricated by horizontal twin‐roll casting
Author(s) -
Liu S. Y.,
Wang A. Q.,
Lu S. J.,
Xie J. P.
Publication year - 2018
Publication title -
materialwissenschaft und werkstofftechnik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.285
H-Index - 38
eISSN - 1521-4052
pISSN - 0933-5137
DOI - 10.1002/mawe.201700217
Subject(s) - materials science , intermetallic , copper , annealing (glass) , composite material , aluminium , composite number , electrical resistivity and conductivity , casting , metallurgy , alloy , electrical engineering , engineering
Horizontal twin‐roll casting technology was successfully introduced to produce high‐performance copper/aluminum (Cu/Al) laminated composites. The interface morphology, electrical properties and peeling strength after different annealing and cold rolling processes were investigated and contrasted with Cu/Al clad plates fabricated by conventional methods. The results show that sound metallurgical bonding between the copper and aluminum matrix can be attained after the horizontal twin‐roll casting processes and Al 2 Cu is the only intermetallics at the interfacial region, the thickness of interfacial interlayer is about 0.7 μm. The peeling strength is 31.4 N/mm and can be further increased to 37.1 N/mm after annealing at 250 °C. However, higher temperature like 400 °C will cause the excessive growth of intermetallics so that peeling strength sharply decreases to 9.2 N/mm. Electrical conductivity of the clad plate is 51 MS/m. At the same electrical current intensity, the temperature‐rise of the composite plate is between the pure copper plate and the aluminum plate, and closer to the copper plate. All of the properties are outstanding than that of Cu/Al clad plate fabricated by conventional methods.