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Weld strength in solid–state recycling of aluminum chips
Author(s) -
Shamsudin S.,
Lajis M.A.,
Zhong Z.W.,
Ahmad A.,
Wagiman A.
Publication year - 2017
Publication title -
materialwissenschaft und werkstofftechnik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.285
H-Index - 38
eISSN - 1521-4052
pISSN - 0933-5137
DOI - 10.1002/mawe.201600776
Subject(s) - materials science , ultimate tensile strength , surface roughness , welding , composite material , chip , deformation (meteorology) , surface finish , factorial experiment , aluminium , die (integrated circuit) , metallurgy , nanotechnology , engineering , statistics , mathematics , electrical engineering
In solid‐state recycling, chip morphology related parameters such as size fraction, surface topography and geometry are important factors in resulting final bond strength. Analyzing deformation parameters together with chip morphology can provide an insight of which factors are very crucial to mechanical performance of the recycled chips. This work investigates the effect of chip morphology and in particular chip roughness and surface area on the weld strength of direct recycled aluminum chips. The influence of these factors were compared with the influences of temperature and pressure. Full factorial design with center point analysis was adopted to rank the factors effects. The chips of AA6061 were cold compacted at 10 tonnes and subsequently hot forged through the dog bone shape‐die at different operating regimes. The elastic and plastic behavior and ultimate tensile strength of the hot‐pressed samples were analyzed and compared. It was found that temperature and pressure are more important to be controlled rather than the chip morphology. Low chip roughness incorporated with high temperature revealed a very significant influence over the weld strength attainment. Regardless of the chip roughness, the bond strength can still be maximized when other deformation factors were controlled within the minimum specified limit.