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Korrosionsbeständigkeit einer auf Kupfer stromlos abgeschiedenen NiP‐Schicht mit Nickel‐Strike‐Aktivierung
Author(s) -
Dai K. J.,
Xiong Y.,
Yin J. H.
Publication year - 2013
Publication title -
materialwissenschaft und werkstofftechnik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.285
H-Index - 38
eISSN - 1521-4052
pISSN - 0933-5137
DOI - 10.1002/mawe.201300130
Subject(s) - coating , materials science , corrosion , nickel , metallurgy , scanning electron microscope , substrate (aquarium) , adhesive , porosity , adhesion , layer (electronics) , chemical engineering , composite material , oceanography , engineering , geology
Electroless Ni‐P coating was successfully deposited on Cu substrate by strike nickel activation process. The specific pretreatment steps were discussed. The surface and cross‐section morphologies, phosphorus content, adhesive force, and corrosion resistance were characterized for electroless Ni‐P coating. Scanning electron microscopy shows the compact surface. Energy dispersed X‐ray shows the 11.4% phosphorus content. Adhesive test shows the qualified adhesion of electroless Ni‐P coating to substrate. Porosity test shows pores free of the coating, and immersion test in 10% HCl solution indicates the better corrosion resistance of electroless Ni‐P coating in protecting Cu substrate from the corrosion of Cl ions. Thus, strike nickel activation pretreatment is suitable for electroless Ni‐P coating on Cu substrate.