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Finite element analysis of the indentation stress characteristics of the thin film/substrate systems by flat cylindrical indenters
Author(s) -
Xu BX,
Zhao B,
Yue ZF
Publication year - 2006
Publication title -
materialwissenschaft und werkstofftechnik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.285
H-Index - 38
eISSN - 1521-4052
pISSN - 0933-5137
DOI - 10.1002/mawe.200600013
Subject(s) - materials science , indentation , finite element method , composite material , von mises yield criterion , modulus , stress (linguistics) , enhanced data rates for gsm evolution , hardening (computing) , plasticity , shearing (physics) , thin film , structural engineering , layer (electronics) , engineering , linguistics , philosophy , nanotechnology , telecommunications
The indentation stress characteristics of thin film/substrate systems by the flat cylindrical indenters have been simulated by means of the finite element method (FEM). The emphasis was put on the stress distribution ahead of the indenters. The influences of the friction coefficient between the indenter and the thin film, the thickness and hardening modulus of the thin film have been considered. It is found that the stress distribution was not affected by the friction coefficient. But the influence of the thickness and hardening modulus of the thin film on the stress distribution was obvious. At small indentation depth, the plastic deformation occurs at the edge of the indenter only, and the zone will propagation both vertically and laterally with the indentation depth increasing. When the indentation depth reaches a certain value, the thin film at the interface will occur the deformation plastic zone for the case studied in this paper. At lager depths, the two plastic zones will connect, and then the plastic zone propagates along the lateral direction. Beside, it is also found that the maximum of the Mises stress and the shearing stress on the interface occur at 0.8 r and r (r is the radius of the indenter), respectively.