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Numerical Study of Creep Damage Behavior of Thin Film/Substrate Systems under Indentation
Author(s) -
Xu BX.,
Wan J.S.,
Zhao B.,
Yue ZF.
Publication year - 2005
Publication title -
materialwissenschaft und werkstofftechnik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.285
H-Index - 38
eISSN - 1521-4052
pISSN - 0933-5137
DOI - 10.1002/mawe.200400851
Subject(s) - indentation , materials science , creep , composite material , enhanced data rates for gsm evolution , modulus , substrate (aquarium) , nanoindentation , thin film , stress (linguistics) , elastic modulus , nanotechnology , telecommunications , linguistics , oceanography , philosophy , computer science , geology
A numerical study has been performed on the creep damage development of the thin film/substrate systems by the Kachanov‐Rabothov damage law. The emphasis was to study the influence of the modulus ratio of the substrate to the thin film, the size of the indenter and the indentation stress. Results show that two obvious damage zones are found ahead of the indenter. One is at the edge of the indenter, the other is at the interface ahead of the indenter edge. The influence of the modulus ratio of the substrate to the thin film on the indentation damage is not obvious before a certain creep time, and later, the greater modulus ratio of the substrate to the thin film has the smaller damage rate. And the indentation depth rate and the damage rate are also affected by the size of the indenter and indentation stress.