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Wear and Creep Characteristics of a Carbon‐Derived Si 3 N 4 /SiC Micro/Nanocomposite
Author(s) -
Kašiarová M.,
Rudnayová E.,
Kovalčík J.,
Dusza J.,
Hnatko M.,
Šajgalík P.,
Merstallinger A.
Publication year - 2003
Publication title -
materialwissenschaft und werkstofftechnik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.285
H-Index - 38
eISSN - 1521-4052
pISSN - 0933-5137
DOI - 10.1002/mawe.200390071
Subject(s) - creep , materials science , composite material , stress (linguistics) , atmospheric temperature range , deformation (meteorology) , humidity , work (physics) , activation energy , diffusion , bending , friction coefficient , thermodynamics , chemistry , philosophy , linguistics , physics , organic chemistry
In the presented work some properties of a recently developed Si 3 N 4 /SiC micro/nanocomposite have been investigated. The material was tested using a pin on disc configuration. Under unlubricated sliding conditions using Si 3 N 4 pin at 50 % humidity, the friction coefficient was in the range of 0,6 ‐ 0,7. The reduction of humidity resulted in a lower coefficient of friction, in vacuum the coefficient of friction had a value of about 0,6. The wear resistance in vacuum was significantly lower then that in air. The wear patterns on the Si 3 N 4 +SiC disc revealed that mechanical fracture was the wear controlling mechanism. Creep tests were realized in four point bending configuration in the temperature interval 1200‐1400 °C at stresses 50,100 and 150 MPa and the minimal creep deformation rate was established for each stress level. The activation energy, established from the minimal creep deformation had a value of about 360 kJ/mol and the stress exponent values were in the range of 0.8‐1.28. From the achieved stress exponents it can be assumed that under the studied load/temperature conditions the diffusion creep was the most probable creep controlling mechanism.