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Kinetics Study of Curing by FT ‐ IR and Dynamic Thermomechanical Analysis of the Glass‐Conservation Epoxy Resin HXTAL‐NYL‐1
Author(s) -
Tsagkalias I.S.,
Vouvoudi E.C.,
Sideridou I.D.
Publication year - 2013
Publication title -
macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 1022-1360
DOI - 10.1002/masy.201300066
Subject(s) - dynamic mechanical analysis , epoxy , materials science , composite material , glass transition , curing (chemistry) , fourier transform infrared spectroscopy , hardening (computing) , polymerization , thermosetting polymer , elastic modulus , dynamic modulus , kinetics , polymer , chemical engineering , layer (electronics) , engineering , physics , quantum mechanics
Summary This work has focused on the study of a commercially‐available epoxy resin manufactured especially for glass conservation and treatment, HXTAL‐NYL‐1. It has been produced for this purpose and remains crystal clear over time and exposure to direct light. Through Fourier Transform Infrared Spectroscopy (FT‐IR) the degree of conversion (% DC) versus time can be determined following the 910cm −1 peak which corresponds to the oxirane bond and eliminates by time passing. Area calculations for both diminishing and standard peaks used as references help us to evaluate the % DC. This kinetics study revealed strong dependence of % DC on polymerization temperature. Dynamic Thermomechanical Analysis (DMTA) is a widely used technique when cross‐linked polymeric materials require characterization. Information such as elastic modulus (E′), loss modulus (E″), tangent delta (tan δ = E″/E′) and T g are basic properties for future applications of the material. The oscillation occurs in a temperature range, starting with an elastic behavior of the sample and ending to a viscous one. Tan δ curves of the studied resin yield narrow peaks, indicating the rather uniform structure of the polymeric network. The T g values do not vary significantly with hardening temperatures.