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Dielectric Analysis of Short‐Term and Long‐Term Curing of Novel Photo‐Curing Dental Filling Materials
Author(s) -
Steinhaus Johannes,
Frentzen Matthias,
Rosentritt Martin,
Möginger Bernhard
Publication year - 2010
Publication title -
macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 1022-1360
DOI - 10.1002/masy.201051081
Subject(s) - curing (chemistry) , materials science , composite material , dental composite , dielectric , composite number , optoelectronics
Highly glass powder filled photo‐curing dental filling materials based on acrylic resins are used as an alternative for classical amalgam fillings for almost two decades. To improve the performance of the fillings nowadays nano‐particles are introduced in these resins. However, surprisingly less is known about their curing kinetics and how it is affected by the composition of the resin and the kind of the filler. It is shown how the dielectric analysis (DEA) can be used to trace both the short‐term photo‐curing (Figure 1) as well as the long‐term post‐curing of such resins when measuring its ion viscosity. Especially if assisted by other thermo‐analytical methods the DEA allows for a deeper insight in the processes occurring in the dental filling materials. Long‐term measurements over several days using DEA and DMA (dynamic mechanical analysis) exhibit that there are going on significant changes of the properties of the dental material which are relevant for the long‐term performance (Figure 2). The DEA is an easy to handle and cost efficient method to investigate the curing kinetic either for dental composite material engineering as well as for quality insurance purposes.