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Dynamic Mechanical and Dielectric Relaxation Behavior of Chitosan Films: Influence of Water Content
Author(s) -
GonzálezCampos J. Betzabe,
Prokhorov Evgen,
LunaBárcenas Gabriel,
Sanchez Isaac C.,
Kovalenko Yuriy
Publication year - 2009
Publication title -
macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 1022-1360
DOI - 10.1002/masy.200950926
Subject(s) - chitosan , relaxation (psychology) , dielectric , materials science , atmospheric temperature range , water content , thermal , degradation (telecommunications) , composite material , chemical engineering , thermodynamics , chemistry , organic chemistry , electronic engineering , optoelectronics , physics , psychology , social psychology , geotechnical engineering , engineering
The dynamic mechanical dielectric behavior of neutralized chitosan films has been investigated as a function of water content and temperature. Chitosan films exhibit three relaxation processes in the low frequency range: the first one between 86–102 °C, it corresponds to the α ‐relaxation process and shifts to higher temperatures with decreasing water content; a second relaxation was observed from 80 °C to the onset of thermal degradation (240 °C) and it is identified as the σ ‐relaxation often associated with proton mobility; and a third relaxation process in the 240–300 °C temperature range that corresponds to chitosan thermal degradation.
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