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Comparative Study between Wet and Dry Etching of Poly( N ‐vinylcarbazole)
Author(s) -
Moreira Taís,
Possidonio Shirley,
Wang S. Hui,
Onmori Roberto K.
Publication year - 2006
Publication title -
macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 1022-1360
DOI - 10.1002/masy.200651361
Subject(s) - etching (microfabrication) , dry etching , materials science , polymer , photolithography , solvent , polymerization , chemical engineering , reactive ion etching , plasma etching , argon , polymer chemistry , nanotechnology , composite material , chemistry , organic chemistry , layer (electronics) , engineering
This work presents the study of two etching techniques, also applied in polymer. The chosen polymer was poly (N‐vinylcarbazole) (PVK), because of its easy processability and custom of process. The polymer was synthesized by “living” free radical polymerization process. Previous studies on the best technique for film preparation had been made. The photolithography process was done, then in sequence the etching process was applied in two separate steps: the wet etching with a polymer solvent and dry etching with argon and oxygen plasma. The comparison of the results shows a significant difference between the etching methods, which will be suitable for films preparation in aiming at novel electronic devices.