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Synthesis of Low Dielectric Constant Polyetherimide Films
Author(s) -
Chen BorKuan,
Fang YuTing,
Cheng JingRu
Publication year - 2006
Publication title -
macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 1022-1360
DOI - 10.1002/masy.200651006
Subject(s) - polyetherimide , dielectric , materials science , phenylene , ether , polyimide , polymer chemistry , diamine , pyromellitic dianhydride , thermal stability , thermal decomposition , composite material , chemical engineering , polymer , organic chemistry , chemistry , optoelectronics , layer (electronics) , engineering
As the demand for downsizing in microelectronics is increasing, devices require material with lower dielectric constant accordingly. The dielectric constants for most polyimide (PI), including polyetherimide (PEI), films are ∼3.5. In this study, we modified the PEI by incorporating various monomers (fluorinated dianhydride 6FDA and phenylene ether diamines) to reduce the dielectric constant. The dielectric constants of synthesized PEIs decreased with increasing amounts of 6FDA content and phenylene ether units. The T g decreased gradually with PEI containing longer phenylene ether units, but increased with the content of 6FDA. The thermal decomposition temperatures at 10% weight loss were ∼550 °C, indicating that these PEIs have high thermal stability. Both the tensile strength and the modulus decreased with the PEI containing longer phenylene ether units. The PEI synthesized with 40% 6FDA dianhydride and 1,4‐bis(4‐aminophenoxy)benzene ( p BAB) diamine has the lowest dielectric constant of 2.78 at 1 MHz.