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Curing and Glass Transition of Epoxy Resins from Ester‐Carboxylic Acid Derivatives of Mono‐ and Disaccharides, and Alcoholysis Lignin
Author(s) -
Hirose Shigeo,
Hatakeyama Tatsuko,
Hatakeyama Hyoe
Publication year - 2005
Publication title -
macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 1022-1360
DOI - 10.1002/masy.200550630
Subject(s) - epoxy , glass transition , ethylene glycol , differential scanning calorimetry , curing (chemistry) , polymer chemistry , diglycidyl ether , carboxylic acid , ethylene , organic chemistry , chemistry , ether , catalysis , materials science , polymer , bisphenol a , physics , thermodynamics
Abstract Mono‐ and disaccharides (SAC) such as glucose (Glc), fructose (Frc) and sucrose (Suc), and also alcoholysis lignin (AL) were dissolved in ethylene glycol and each of the obtained mixtures was reacted with succinic anhydride to form a mixture of ester‐carboxylic acid derivatives such as SAC‐polyacid, SACPA, and AL‐polyacid, ALPA. Ethylene glycol‐polyacid (EGPA) was also prepared from ethylene glycol. Each of the obtained mixtures of ester carboxylic acid derivatives was reacted with ethylene glycol diglycidyl ether in the presence of a catalytic amount of dimethylbenzylamine to form ester‐epoxy resins. The molar ratios of epoxy groups to carboxylic acid groups ([EPOXY]/[ACID] ratios, mol mol −1 ) was maintained at 1.0. The contents of SACPA and ALPA in the mixtures of SACPA/EGPA, and ALPA/EGPA, respectively, were also varied from 0 to 100 %. The curing reaction of SucPA and ALPA was studied by differential scanning calorimetry (DSC). Activation energy of the curing reaction for the SucPA system was 80.5 kJ/mol. Thermal properties of epoxy resins were studied by DSC. Glass transition temperatures ( T g ) decreased with increasing numbers of repeating units in ester chains between cross‐linking points, suggesting that ester chain lengths between cross‐linking points mainly affect the mobility of ester chains in epoxy resin networks.