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Characterization of the epoxy‐metal interphase: FTIR‐ERAS and spectra calculation for ultra‐thin films
Author(s) -
Wehlack Carsten,
Possart Wulff
Publication year - 2004
Publication title -
macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 1022-1360
DOI - 10.1002/masy.200450123
Subject(s) - interphase , materials science , thin film , fourier transform infrared spectroscopy , polymer , epoxy , attenuated total reflection , adhesive , spin coating , substrate (aquarium) , composite material , coating , reflection (computer programming) , spectral line , metal , analytical chemistry (journal) , chemical engineering , nanotechnology , chemistry , organic chemistry , metallurgy , oceanography , computer science , engineering , genetics , biology , layer (electronics) , programming language , physics , astronomy , geology
The interphase between polymers and metal substrates can be elucidated by studying ultra‐thin films. In this paper, spin coating films (20 nm ‐ 2 μm) are prepared from a two‐part epoxy adhesive on Au, Al and Cu. After room temperature cure, the chemical structure of the epoxy films is studied by FTIR external reflection absorption spectroscopy (FTIR‐ERAS) and the results are compared with the state in the polymer bulk as measured by attenuated total reflection (FTIR‐ATR). Inevitably, this evaluation of the thin film spectra has to account for the optical situation which is significantly different from bulk measurements. Spectra calculation provides the essential tool for a reasonable comparison between bulk and thin film spectra, thus allowing for a detailed quantitative analysis. Thickness and substrate effects on the interphase can then be separated from the optical situation of the measurement. The results reveal very specific features caused by adhesive interactions and different cure behaviour in the interphase on different metal surfaces.