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Characterization of epoxy prepreg SPX 8800 system by isothermal differential scanning calorimetry
Author(s) -
Wang Qian,
Storm Birgit K.
Publication year - 2003
Publication title -
macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 1022-1360
DOI - 10.1002/masy.200390068
Subject(s) - differential scanning calorimetry , epoxy , isothermal process , curing (chemistry) , diglycidyl ether , materials science , bisphenol a , activation energy , composite material , fourier transform infrared spectroscopy , glass transition , polymer chemistry , analytical chemistry (journal) , chemical engineering , chemistry , polymer , thermodynamics , organic chemistry , physics , engineering
Abstract Isothermal Differential Scanning Calorimetry (DSC) was used to study the curing behavior of epoxy prepreg SPX 8800 system, which contains DGEBA/DICY/Diuron (Diglycidyl ether of bisphenol A/Dicyandiamide/Diuron) reinforced by three layers of glass fibre. The rate curves from the DSC study agreed well with those obtained from the isothermal FT Near Infrared (FTNIR) study and similar activation energy was obtained in the range of 92.6 to 87.7 kJ/mol up to 50% total conversion. Modelling of the whole DSC trace with empirical equation dx/dt=kx m (A‐x) n gave relatively good fitting of the experimental curves (the error is lower than 15%.) in the whole studied cure temperature range (75‐110°C) and no significant difference in cure kinetics was observed for both epoxy prepreg and neat resin.