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Polymer design for thermally stable polyimides with low dielectric constant
Author(s) -
Goto Kohei,
Akiike Toshiyuki,
Inoue Yasutake,
Matsubara Minoru
Publication year - 2003
Publication title -
macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 1022-1360
DOI - 10.1002/masy.200350927
Subject(s) - imide , dielectric , materials science , fluorine , polymer , polyimide , polymer chemistry , polymerization , analytical chemistry (journal) , chemistry , organic chemistry , layer (electronics) , composite material , metallurgy , optoelectronics
We successfully prepared a series of thermally stable polyimides (PIs) with low dielectric constant ( k ) by introducing bulky diphenyl fluorenylidene moieties in backbone. The lowest k was found to be 2.77 among non‐fluorinated PIs and 2.35 among fluorinated ones. In order to prove the lowest limit of k in PIs, we prepared soluble and thermally stable polyarylenes (PArs) without polar imide linkage with the same aromatic moieties by coupling polymerization. The lowest k was 2.7 without fluorine (F) and 2.2 with F atom, which showed also promising for low k materials. From these results, PIs we prepared were estimated to the lowest k values among PIs. On the basis of statistics on these results, we could express contour lines of k as a function of imide concentration and F content with high correlation factor (r= 0.96) in PIs and PArs.