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A way to halogenfree, flame‐retardant laminates for electronic applications
Author(s) -
Von Gentzkow W.,
Huber J.,
Rogler W.,
Wilhelm D.
Publication year - 1993
Publication title -
makromolekulare chemie. macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 0258-0322
DOI - 10.1002/masy.19930740120
Subject(s) - fire retardant , casing , materials science , polymer , constructive , composite material , electronics , mechanical engineering , computer science , engineering , electrical engineering , process (computing) , operating system
Due to legal specifications and standards flame retardant polymers are used as insulating materials for electrical cable and wire, as casing and constructive materials in electrical engineering, as encapsulation materials for electronic components and in laminates for printed circuit boards. The most effective way to achieve flame retardancy is by using halogenated organic materials. Because of ecological reasons a major trend is the development of halogenfree non‐corrosive flame retardant polymer materials. On the laminate side Siemens R&D developed a way to halogenfree laminates meeting the UL 94V‐O specification.