Premium
Novel high temperature resins based on bis(4‐maleimido‐phenyl)methane
Author(s) -
Zahir S.,
Chaudhari M. A.,
King J.
Publication year - 1989
Publication title -
makromolekulare chemie. macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 0258-0322
DOI - 10.1002/masy.19890250114
Subject(s) - maleimide , thermosetting polymer , adduct , glass transition , polymer chemistry , propenyl , polymerization , chemistry , polymer , materials science , organic chemistry
A novel high temperature thermosetting resin system based on the addition polymerization of bis (4‐maleimidophenyl)methane and o, o′‐diallyl‐bisphenol A is presented in this paper. This system offers the combination of easy solventless processing and the high temperature and toughness performance characteristics demanded for the fabrication of C‐fibre laminates. The mechanism of the polyaddition reaction is unusual. In a first step an ENE addition reaction of the maleimide to the allyl group occurs to give a 1:1 adduct with a propenyl phenol type of structure. This is then followed by a Diels‐Alder addition reaction of another maleimide functional group to the ENE adduct (by the so‐called Wagner‐Jauregg reaction) to give a densely crosslinked polymer with glass transition temperatures well over 280°C.