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A heat resistant PIQ, polymer‐based interconnection using a multilevel lift‐off pillar fabrication
Author(s) -
Sanséau P.,
Schiltz A.,
Nechtschein J.
Publication year - 1989
Publication title -
makromolekulare chemie. macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 0258-0322
DOI - 10.1002/masy.19890240135
Subject(s) - interconnection , fabrication , materials science , polyimide , dielectric , pillar , chemical mechanical planarization , lift (data mining) , polymer , planar , optoelectronics , electronic engineering , layer (electronics) , composite material , computer science , mechanical engineering , engineering , telecommunications , alternative medicine , data mining , computer graphics (images) , medicine , pathology
To achieve a planar multilevel interconnection, we have developed a process using an improved lift‐off pillar fabrication technique in conjunction with a new kind of heat resistant polymer, a copolyimide‐isoindoloquinazolinedione polymer (PIQ). As spin‐on dielectric layer, the PIQ polyimide is shown to satisfy both the processing criteria and interconnection criteria (high thermal resistance, good planarization properties and excellent dielectric properties).