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Photosensitive organosilicon polymers for microlithographic application
Author(s) -
Inoue Takashi,
Sugiyama Hisashi,
Nate Kazuo,
Mizushima Akiko
Publication year - 1989
Publication title -
makromolekulare chemie. macromolecular symposia
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 76
eISSN - 1521-3900
pISSN - 0258-0322
DOI - 10.1002/masy.19890240119
Subject(s) - organosilicon , photoresist , polymer , silicon , materials science , resist , layer (electronics) , polymer chemistry , chemical engineering , photochemistry , chemistry , nanotechnology , composite material , optoelectronics , engineering
Two new families of photosensitive organo‐silicon polymers are described. One is based on the Si‐Si σ‐bond photochemistry and another is based on the combinations of new alkaline‐soluble organosilicon polymers with diazoquinone photosensitizers. Both of these photoactive materials not only give positive photoresist formulations but can act as oxygen reactive ion etch masks in the double‐layer resist scheme to finally offer steep submicrometer organic patterns with high aspect ratio.