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An Oxygen‐Insensitive Degradable Resist for Fabricating Metallic Patterns on Highly Curved Surfaces by UV‐Nanoimprint Lithography
Author(s) -
Hu Xin,
Huang Shisong,
Gu Ronghua,
Yuan Changsheng,
Ge Haixiong,
Chen Yanfeng
Publication year - 2014
Publication title -
macromolecular rapid communications
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.348
H-Index - 154
eISSN - 1521-3927
pISSN - 1022-1336
DOI - 10.1002/marc.201400251
Subject(s) - resist , materials science , nanoimprint lithography , pentaerythritol , monomer , thermoplastic , polymer , chemical engineering , composite material , nanotechnology , layer (electronics) , fabrication , medicine , alternative medicine , fire retardant , pathology , engineering
In this paper, an oxygen‐insensitive degradable resist for UV‐nanoimprint is designed, comprising a polycyclic degradable acrylate monomer, 2,10‐diacryloyloxymethyl‐1,4,9,12‐tetraoxaspiro [4.2.4.2] tetradecane (DAMTT), and a multifunctional thiol monomer pentaerythritol tetra(3‐mercaptopropionate) (PETMP). The resist can be quickly UV‐cured in the air atmosphere and achieve a high monomer conversion of over 98%, which greatly reduce the adhesion force between the resist and the soft mold. High conversion, in company with an adequate Young's modulus (about 1 GPa) and an extremely low shrinkage (1.34%), promises high nanoimprint resolution of sub‐50 nm. The cross‐linked resist is able to break into linear molecules in a hot acid solvent. As a result, metallic patterns are fabricated on highly curved surfaces via the lift off process without the assistance of a thermoplastic polymer layer.