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Modification of Polymer Substrates with Low Surface Free Energy Material by Low‐Temperature Cured Polybenzoxazine
Author(s) -
Liao ChunSyong,
Wu JiannShing,
Wang ChihFeng,
Chang FengChih
Publication year - 2008
Publication title -
macromolecular rapid communications
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.348
H-Index - 154
eISSN - 1521-3927
pISSN - 1022-1336
DOI - 10.1002/marc.200700646
Subject(s) - curing (chemistry) , materials science , polymer chemistry , surface modification , polymer , polycarbonate , radical initiator , surface energy , phenol , chemical engineering , composite material , chemistry , copolymer , organic chemistry , engineering
The B‐ala/AIBN PBZ system has a high extent of ring‐opening of oxazine because phenol‐containing oligomers are formed at the early stage of the curing process. As a result, the B‐ala/AIBN PBZ system possesses a relatively stronger intramolecular hydrogen bonding and lower surface energy than the pure B‐ala system at low temperature curing. In this context, poly(4‐vinyl pyridine), poly(4‐vinyl phenol) thin films and polycarbonate substrates, which lack liquid resistance, possess low surface free energy after modification with B‐ala/AIBN = 5/1 PBZ.