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Strong and Flexible Carbon Fiber Fabric Reinforced Thermoplastic Polyurethane Composites for High‐Performance EMI Shielding Applications
Author(s) -
Duan Ningmin,
Shi Zhenyu,
Wang Jilai,
Wang Guilong,
Zhang Xianzhi
Publication year - 2020
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.201900829
Subject(s) - materials science , composite material , electromagnetic shielding , thermoplastic polyurethane , composite number , emi , electromagnetic interference , ultimate tensile strength , elastomer , electronic engineering , engineering
Electromagnetic shielding materials play a significant role in solving the increasing environmental problem of electromagnetic pollutions. The commonly used metal‐based electromagnetic materials suffer from high density, poor corrosion resistance, and high processing cost. Polymer composites exhibit unique combined properties of lightweight, good shock absorption, and corrosion resistance. In this study, a novel high angle sensitive composite is fabricated by combining carbon fiber (CF) fabric with thermoplastic polyurethane elastomer (TPU). The effect of stacking angle of CF fabric on EMI shielding performance of composite is studied. When the stacking angle of CF fabric changed, the electromagnetic interference (EMI) shielding effectiveness (SE) of CF fabric/TPU composite can reach a maximum of 73 dB, and the tensile strength can reach 168 MPa. In addition, the composite has anisotropic conductivity, which is conductive along the plane direction and nonconductive along the thickness direction. Moreover, the CF fabric/TPU composite manifests exceptional EMI‐SE/density/thickness value of 383 dB cm 2 g −1 , which is higher than most of current EMI shielding composites reported in literature. In summary, CF fabric/TPU composite is an excellent EMI shielding material that is lightweight, highly flexible, and mechanically robust, which can be applied to the field of aerospace and some intelligent electronic devices.