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Cu x S/PAN 3D Nanofiber Mats as Ultra‐Lightweight and Flexible Electromagnetic Interference Shielding Materials
Author(s) -
Li Heng,
Jensen Martin,
Wang Ning,
Chen Yang,
Gao Yaxue,
Chen Xueyan,
Li Xianfeng
Publication year - 2019
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.201900482
Subject(s) - materials science , electromagnetic shielding , polyacrylonitrile , nanofiber , composite material , thermal stability , copper sulfide , copper , electromagnetic interference , spinning , composite number , polymer , chemical engineering , metallurgy , electrical engineering , engineering
Shielding materials are becoming increasingly important, but present materials suffer from either insufficient mechanical stability or limited shielding properties. In this study, 3D flexible copper sulfide (Cu x S)/polyacrylonitrile (PAN) nanofiber mats are developed via air spinning followed by chemical reaction with copper salt. The Cu x S/PAN nanofiber mats exhibit an ultra‐lightweight density of 0.044 g cm −3 and a thickness of 0.423 mm. Stable electromagnetic interference (EMI) shielding effectiveness (SE) (29–31 dB) of the Cu x S/PAN composite is achieved in the frequency range of 500–3000 MHz. EMI SE per unit surface density of 16 655.92 dB cm 2 g −1 is several orders of magnitude higher than most copper sulfide containing EMI shielding materials reported in literature. In addition, the introduction of the Cu x S improves the thermal stability and launderability of the PAN mats giving the mats thermal, mechanical, and aqueous stability. Finally, the shielding mechanism of the Cu x S/PAN nanofiber mats for electromagnetic waves is proposed