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High Thermal Conductivity Nanocomposites Based on Conductive Polyaniline Nanowire Arrays on Boron Nitride
Author(s) -
Bai Yufeng,
Han Weifang,
Ge Chunhua,
Liu Rui,
Zhang Rui,
Wang Lixia,
Zhang Xiangdong
Publication year - 2019
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.201900442
Subject(s) - materials science , boron nitride , electrical conductor , polyaniline , composite material , nanocomposite , thermal conductivity , thermal stability , composite number , electrical resistivity and conductivity , nanowire , conductivity , conductive polymer , nanotechnology , chemical engineering , polymer , chemistry , electrical engineering , engineering , polymerization
With the development of soft electronics, conductive composites are garnering an increasing amount of attention. The electrical conductivity, thermal conductivity, and electrical stability of conductive composites are all very important. In particular, the thermal conductivity of conductive composites is critical to the stability of their conductive properties. However, little is reported on thermal management in conductive systems. Herein, sufficiently hydroxylated boron nitride nanosheets (BN‐OH)@polyaniline (PANI) composite nanosheets with a high thermal conductivity and outstanding conductance stability are reported. PANI nanowire arrays are aligned vertically on BN‐OH. This well‐ordered nanostructure provides the means to form a good conductive and thermally conductive path. Notably, the composite through‐plane thermal conductivity is 2.1 W m −1 K −1 (≈1000% that of pure PANI) and that the resistivity of the composite is 1.38 Ω cm. Importantly, the resistivity of the composite remains unchanged after 1 h of work. The results show that this composite has prospective applications for use in soft electronics.