Premium
Ultralight and Low Thermal Conductivity Polyimide–Polyhedral Oligomeric Silsesquioxanes Aerogels
Author(s) -
Wu Yiwei,
Zhang Wenchao,
Yang Rongjie
Publication year - 2018
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.201700403
Subject(s) - aerogel , polyimide , materials science , thermal conductivity , thermal insulation , shrinkage , composite material , thermal stability , conductivity , polymer chemistry , layer (electronics) , chemical engineering , chemistry , engineering
The research on rapid growing, organic, and ultralight cross‐linking polyimide aerogels is receiving significant interest. In this work, poly(aminophenyl) silsesquioxanes (PAPSQ) are introduced as a cross‐linker into the polymide (PI) aerogel. A comparative aerogel is prepared, using 1,3,5‐triaminophenoxybenzene (TAB) as a cross‐linker. The aerogels are characterized in terms of their micro‐ and nanostructures, density, shrinkage, thermal conductivity and insulation, and mechanical properties. It is found that the PI‐PAPSQ aerogel have lower density, smaller shrinkage, lower thermal conductivity, higher thermal stability and insulation, and higher compression strength than the PI‐TAB aerogel. The 1.1 wt% PI‐PAPSQ shows the lowest aerogel density (0.010 g cm −3 ) and the 2.2 wt% PI‐PAPSQ has a lower thermal conductivity (22.90 mW (m K) −1 than air. A model of the PI‐TAB and PI‐PAPSQ cross‐linking networks are proposed to explain the excellent performance of the PI‐PAPSQ aerogel.