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Thermal and Lithographic Performance of Silsesquioxane with Cycloaliphatic Epoxy‐Siloxane Hybrid Spacer for Soft Lithography
Author(s) -
Ramli Mohamad Riduwan,
Ramli Rafiza,
Mohamed Khairudin,
Ahmad Zulkifli
Publication year - 2018
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.201700371
Subject(s) - materials science , lithography , soft lithography , silsesquioxane , resist , thermal stability , thermogravimetric analysis , differential scanning calorimetry , epoxy , siloxane , mold , pdms stamp , composite material , polymer , chemical engineering , fabrication , optoelectronics , layer (electronics) , engineering , thermodynamics , medicine , alternative medicine , physics , pathology
Pattern replication and fidelity are crucial during soft lithography process. The flexibility and surface energy of the resist with that of the master mold are among the factors in determining such an effect. In this work, polysilsesquioxane bearing cycloaliphatic‐epoxy spacer of different chain length at tethered positions is synthesized. Pattern replication using soft lithography is made using polymethylmethacrylate (PMMA) as master mold. The thermal and UV‐cured lithographic performances are studied using differential scanning calorimetry (DSC) and thermal gravimetric analysis (TGA). It shows that chain length of spacer induces flexibility and thermal stability. Despite chain flexibility, increase in spacer length results in poor lithographic performance. This can be attributed to the behavior of spreading parameter with different surface energy between the PMMA mold and the polysiloxane resist surfaces.