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Morphology, Electrical, and Rheological Properties of Silane‐Modified Silver Nanowire/Polymer Composites
Author(s) -
Yu YiHsiuan,
Ma ChenChi M.,
Yuen SiuMing,
Teng ChihChun,
Huang YuanLi,
Wang Ikai,
Wei MingHsiung
Publication year - 2010
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.201000180
Subject(s) - materials science , epoxy , silane , composite material , rheology , x ray photoelectron spectroscopy , morphology (biology) , polymer , percolation threshold , chemical engineering , electrical resistivity and conductivity , engineering , electrical engineering , biology , genetics
Electrically conducting films containing AgNws, hydrophilic and hydrophobic resins were prepared. FT‐IR reveals that the interface between the AgNws and epoxy could be successfully modified by APTES. XPS shows that the AgNws were attracted by hydrogen bonds of NH 2 and NH groups after APTES modification. SEM analysis shows that the AgNws were well dispersed in the resin. The AgNws were also blended with hydrophilic and acrylic resins, and the resulting blends were compared with AgNws/epoxy blends. Results show that AgNw/PVA‐resin films possess the lowest surface electrical resistance. The AgNw/PVA‐resin and silane‐modified AgNw/epoxy resin conductive films possess a similar electrical percolation threshold.