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Effect of the Deformation Temperature on the Shape‐Memory Behavior of Epoxy Networks
Author(s) -
Feldkamp Diane M.,
Rousseau Ingrid A.
Publication year - 2010
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.201000035
Subject(s) - epoxy , materials science , composite material , deformation (meteorology) , atmospheric temperature range , shape memory alloy , shape memory polymer , thermal stability , temperature cycling , thermal , chemical engineering , thermodynamics , physics , engineering
The impact of the deformation conditions, specifically the temperature, on the shape‐memory behavior and characteristics of epoxy SMPs is studied. By simply varying the temperature during deformation (i.e., the programming step of the SM effect), the ultimate strain of the formulated epoxy was improved three‐ to five‐fold, thereby providing for an increased range of reachable deformation strains during SM thermo‐mechanical cycling. This research unveils newly developed epoxy‐based SMPs with improved deformability range and high strength with intrinsically good thermal and chemical stability.