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Alternating Encapsulation of Water‐Soluble Components in a One‐Dimensional Structure
Author(s) -
Park Chul Ho,
Lee Jonghwi
Publication year - 2010
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.200900185
Subject(s) - materials science , conductivity , aqueous solution , electrospinning , embedding , encapsulation (networking) , composite material , chemical engineering , polymer , computer science , chemistry , computer network , artificial intelligence , engineering
A novel multi‐compound electrospinning method is described, using high‐conductivity aqueous solutions for the inner fluid and low‐conductivity polymeric solutions for the outer fluids. The driving fluid among inner fluids at the equivalent conductivity is switched at a certain frequency. The switching of the Taylor cone results in the alternative embedding of inner components. Also, the number of inner capillaries is proportional to the encapsulation components. Therefore, our method might be useful to alternatively encapsulate a variety of water‐soluble materials in fibers.