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Thermoviscoelastic Behavior of Film‐Insert‐Molded Parts Prepared under Various Processing Conditions
Author(s) -
Kim Seong Yun,
Lee Seung Hwan,
Baek Soo Jin,
Youn Jae Ryoun
Publication year - 2008
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.200800193
Subject(s) - materials science , composite material , shrinkage , mold , molding (decorative) , annealing (glass) , ultimate tensile strength , residual stress , insert (composites) , deformation (meteorology)
Film‐insert‐molded (FIM) tensile specimens were prepared under various molding conditions to investigate the effects of wall temperature and packing pressure on the residual stress distribution and thermoviscoelastic deformation. The warpage of the specimen increased with increasing mold‐wall temperature difference and decreased with increasing packing pressure. The FIM specimens produced with unannealed films showed the warpage reversal phenomenon (WRP) during annealing and the degree of WRP was affected significantly by the molding conditions and thermal shrinkage of the film. The warpage of the specimen was predicted by three‐dimensional flow and stress analyses and the prediction was in good agreement with the experimental results.