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Electrospray Deposition of Photoresist: A Low Impact Method for the Fabrication of Multilayered Films
Author(s) -
Rietveld Ivo B.,
Suganuma Naotoshi,
Kobayashi Kei,
Yamada Hirofumi,
Matsushige Kazumi
Publication year - 2008
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.200700419
Subject(s) - photoresist , materials science , resist , deposition (geology) , fabrication , substrate (aquarium) , spin coating , thin film , electrospray , coating , nanotechnology , layer (electronics) , chemistry , chromatography , mass spectrometry , medicine , paleontology , pathology , sediment , geology , biology , oceanography , alternative medicine
Electrospray deposition has been investigated as a substitute for photoresist spin coating. The morphology of Microposit S1813 photoresist films has been studied as a function of several spray conditions including resist concentration, substrate surface, and flow rate. Film morphology is controlled by three process parameters: the surface energy determines the equilibrium conditions of resist on the substrate; the viscosity and volume flux determine the relaxation time for the depositing resist solution after impact on the substrate. Electrosprayed photoresist films have been used for photolithographic patterning and it has been demonstrated that electrospray deposition is an effective method for deposition of photoresist on top of fragile, thin films, which can be used for multilayered thin film fabrication.