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Enhancement of Epoxy Resin/Copper Heterojunction by Introduction of Sulfur‐Containing Polymers
Author(s) -
Hirano Hiroshi,
Okada Takuto,
Nakamura Yoshinobu,
Kadota Joji,
Watase Seiji,
Hasegawa Kiichi
Publication year - 2006
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.200500321
Subject(s) - epoxy , materials science , copper , adhesive , composite material , curing (chemistry) , polymer , sulfur , shear strength (soil) , aluminium , metallurgy , layer (electronics) , environmental science , soil science , soil water
Abstract Summary: Epoxy resins are widely used in electronics and electric industries because of their superior properties. In recent years, excellent bonding properties for metals (e.g., copper, gold, aluminium, silver, etc.), to which it is hard to adhere, have become desirable for epoxy resins in the electric and electronics industrial fields. However, epoxy resins have only poor bonding strength to the metals. In order to increase the heterojunction strength between epoxy resins and copper, the introduction of sulfur, providing strong interactions with metals, was investigated. TDP polyester and MPS polythioesters containing sulfur moieties were employed as the sulfur‐containing modifiers for the epoxy resin. Epoxy resins containing a modifier (5–20 phr) and a curing agent were cured between copper plates at 120 °C for 2 h and at 170 °C for 2 h. The effect of the added modifiers was evaluated by the lap‐shear testing method. It could be demonstrated that MPS polythioesters have a beneficial effect on the enhancement of the epoxy resin/copper heterojunction. The most effective example was the addition of 20 phr of the MPS_7 polythioester, which increased the lap shear strength from 5.7 to 17 MPa.Improvement of lap shear strengths of adhesive copper joints by sulfur‐containing modifiers.