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Curing Behavior of Epoxy Resin Using Controllable Curing Agents Based on Nickel Complexes
Author(s) -
Omrani Abdollah,
Ghaemy Mousa,
Rostami Abbas A.
Publication year - 2006
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.200500291
Subject(s) - curing (chemistry) , diglycidyl ether , epoxy , materials science , thermosetting polymer , differential scanning calorimetry , activation energy , thermal stability , bisphenol a , kinetics , polymerization , polymer chemistry , composite material , chemical engineering , polymer , chemistry , organic chemistry , physics , quantum mechanics , thermodynamics , engineering
Summary: The curing reaction kinetics and mechanism of the diglycidyl ether of bisphenol A (DGEBA) with three complexes of Ni(II) with diethylentriamine (Dien), Pyrazole (Pz) and Pyridine (Py) as ligands have been studied using differential scanning calorimetry (DSC). The curing reaction was characterized by high cure onset and peak maximum temperatures. The kinetics of the curing reaction were evaluated using the Ozawa method. The average values of activation energy for the three nickel complexes increased in the order: Dien‐based curing agent > Pz‐based curing agent > Py‐based curing agent. Three main curing mechanisms (catalytic, complex cation and free ligand polymerization path) have been proposed depending on the cure temperature. It was also shown that the cure kinetics of DGEBA with Dien‐ and Py‐based complexes could be described by the Sestak‐Berggren equation. The water absorption, chemical resistance and thermal stability of the thermosets were also studied. The results showed that the thermoset obtained with the Py‐based complex was more thermally stable than those obtained with the other two curing agents.Activation energy versus conversion plots for the epoxy systems studied.