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High Temperature Thermosets With a Low Coefficient of Thermal Expansion
Author(s) -
Wippl Johann,
Schmidt HansWerner,
Giesa Reiner
Publication year - 2005
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.200500120
Subject(s) - materials science , thermosetting polymer , composite material , flexural strength , thermal expansion , thermal stability , cyanate ester , composite number , ultimate tensile strength , epoxy , filler (materials) , glass transition , polymer , physics , quantum mechanics
Summary: Polymeric thermosetting composites can be used as metal substitutes for certain applications if they possess high temperature stability in air, low coefficient of thermal expansion (CTE), and sufficient flexural strength, in combination with competitive costs. Commercial bismaleimide, bisnadimide, and cyanate ester thermosetting materials were selected due to their excellent thermal stability. Low CTEs were achieved by adding high loading levels of fused silica or silicon nitride fillers. Several optimized composites were fabricated by varying the materials, composition, and cure conditions. Characteristic composite properties, such as CTE, thermal stability, glass transition temperature ( T g ), flexural strength, and filler distribution were investigated. The best system developed consists of Matrimide 5292, a commercial two‐component bismaleimide resin, filled with 75% Silbond FW100EST, and additionally reinforced with 0.5% Twaron short fibers. This composite is distinguished by a CTE around 15 ppm · K −1 , a T g around 340 °C, flexural strength above 100 MPa, and attractive material costs.Matrimid 5292 (75%)/Silbond FW100AST (24.5%), and Twaron 2 mm short fibers (0.5%). Three fibers are visible, embedded and well dispersed in the matrix.