Premium
Formaldehyde Resins Bearing Diaminodiphenylmethane Groups: Synthesis, Characterization and Properties
Author(s) -
Mustata Fanica,
Bicu Ioan
Publication year - 2004
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.200400027
Subject(s) - formaldehyde , epoxy , materials science , curing (chemistry) , differential scanning calorimetry , synthetic resin , cyclohexanone , thermogravimetry , thermal stability , polymerization , urea formaldehyde , polymer chemistry , nuclear chemistry , catalysis , composite material , organic chemistry , chemical engineering , adhesive , chemistry , polymer , physics , layer (electronics) , engineering , thermodynamics
Summary: Novel formaldehyde resins bearing diaminodiphenylmethane groups were synthesized by the polymerization of a mixture of diaminodiphenylmethane (DDM), cyclohexanone (CHx) and o ‐cresol (o‐Cz) with formaldehyde (FA) in the presence of an acid catalyst (HCl). The resins obtained were characterized by spectral, elemental and thermal analysis and used as a hardener for epoxy resins. The curing and temperature behavior of these epoxy resin/formaldehyde systems were investigated using differential scanning calorimetry and thermogravimetry techniques. The resins had good thermal stability and the activation energies of degradation reactions had values between 70–98 kJ · mol −1 .The curing reaction of epoxy resins with the DDM/CHx/o‐Cz/formaldehyde resins.