Premium
Simple and Fast Organic Device Encapsulation Using Polyisobutene
Author(s) -
Toniolo Rogério,
Hümmelgen Ivo A.
Publication year - 2004
Publication title -
macromolecular materials and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 96
eISSN - 1439-2054
pISSN - 1438-7492
DOI - 10.1002/mame.200300329
Subject(s) - materials science , passivation , encapsulation (networking) , contact resistance , chemical engineering , composite material , optoelectronics , layer (electronics) , computer science , computer network , engineering
Summary: We demonstrate the use of polyisobutene (PIB) in a glass encapsulation method suitable for organic devices. The PIB viscosity at environmental temperatures provides a fast and non‐aggressive passivant layer formation method for device protection with glass. Due to its fully aliphatic character, PIB is suitable for passivating organic light‐emitting and photovoltaic devices. The observed preservation of encapsulated Ca films demonstrates the PIB suitability for air‐unstable metals passivation. Stable I ( V ) characteristics and increased operational lifetime were observed in PIB‐encapsulated organic devices. This encapsulation method is cheap, simple, and dispenses intensive equipment use, so that it is appropriate even for laboratories with restricted experimental facilities.Setup used for Ca samples testing. The right Ca contact was encapsulated with PIB and a glass cover plate (dashed square). The electrical diagram of the apparatus used to obtain the resistance behavior is also shown.