Nanoporous Low Dielectric Cyclosiloxane Bearing Polysilsesquioxane Thin Films Templated by Poly( ε ‐caprolactone)

Abstract Summary: Dielectric cyclosiloxane bearing polysilsesquioxanes (CS‐PSSQs) were prepared by acid catalyzed polymerization using 2,4,6,8‐tetramethyl‐2,4,6,8‐tetra(trimethoxysilylethyl)cyclotetrasiloxane. The molecular weight, and content of the functional end‐groups of the CS‐PSSQs were found to be dependent on the process parameters, such as the molar ratio of water and catalyst to the OCH 3 group of the silane monomer, the amount of solvent, and the poly( ε ‐caprolactone) (PCL) content, etc. Based on these CS‐PSSQ prepolymers, nanoporous organic/inorganic hybrid thin films were fabricated by spin‐coating mixtures of these prepolymers with star‐shaped PCL on the silicon substrate, and subsequently heating them at 150 and 250 °C for 1 minute each and then at 420 °C for 1 hour. A dielectric constant as low as 2.28 was achieved for the nanoporous PCL/CS‐PSSQ (3:7 v/v) film, along with low moisture absorption in ambient and water conditions, primarily due to the presence of hydrophobic moieties such as ethylene and methyl groups of the polymer and nano‐sized hydrophobic pores inside the matrix, resulting in the film having stable dielectric properties. Moreover, the PCL/CS‐PSSQ (3:7 v/v) nanohybrid film revealed a nanoporous structure containing ca. 1.52 nm of average‐sized mesopores, as measured by the N 2 adsorption method. The CS‐PSSQ‐only film showed high mechanical strengths having an elastic modulus and hardness of 6.64 and 0.88 GPa, respectively, for the 7 500 Å thick film and 2.41 and 0.38 GPa, respectively, for the PCL/CS‐PSSQ (3:7 v/v) film. In addition, the crack velocity of the CS‐PSSQ‐only film was found to be ca. 10 −11 m · s −1 in ambient conditions and an aqueous environment, probably due to the enhanced hydrophobicity and mechanical toughness of the incorporated methyl group, siloxane unit and ethylene moieties in the polymer matrix.