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A New Four‐Arm Organosiloxane with Thermopolymerizable Trifluorovinyl ether Groups: Synthesis and Conversion to the Polymer with both Low Dielectric Constant and Low Water Uptake
Author(s) -
Xin Yumeng,
Wang Jiajia,
Jin Kaikai,
Luo Yijie,
Zhou Junfeng,
Wang Yuanqiang,
Sun Jing,
Zheng Shijun,
Fang Qiang
Publication year - 2017
Publication title -
macromolecular chemistry and physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.57
H-Index - 112
eISSN - 1521-3935
pISSN - 1022-1352
DOI - 10.1002/macp.201700010
Subject(s) - dielectric , thermostability , ether , polymer , dissipation factor , sealant , materials science , polymer chemistry , adhesive , microelectronics , boiling , composite material , chemical engineering , chemistry , organic chemistry , nanotechnology , optoelectronics , layer (electronics) , engineering , enzyme
A new fluoro‐containing four‐arm organosiloxane has been successfully synthesized, which can be easily converted to a cross‐linked network, showing water uptake of below 0.12 wt% (maintained in boiling water for 72 h) and dielectric constant of below 2.56 with dissipation factor of near 1.8 × 10 −3 at 30 MHz, as well as showing high transparency and good thermostability. These data indicate that this new organosiloxane is suitable as an adhesive or sealant for the applications in microelectronic industry.