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The Effects of Amide Groups on the Thermal and Optical Properties of Poly(amide‐imide)s with Low Residual Stress for Microelectronic Devices
Author(s) -
Kim Kwangin,
Yoo Taewon,
Ha Hyemin,
Kim Jinyoung,
Han Patrick,
Han Haksoo
Publication year - 2016
Publication title -
macromolecular chemistry and physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.57
H-Index - 112
eISSN - 1521-3935
pISSN - 1022-1352
DOI - 10.1002/macp.201500495
Subject(s) - imide , microelectronics , amide , polymer chemistry , polyamide , materials science , thermal , chemistry , organic chemistry , optoelectronics , physics , meteorology
In this study, poly(amide‐imide)s are synthesized for electronic materials by adding amide groups into polyimide. As it is expected, poly(amide‐imide) shows an amorphous structure with a lower glass transition temperature and residual stress than the neat polyimide due to the high steric hindrance of the amide group. Also, the modification to the polyimide structure leads to higher transmittance and enhances colorless properties. Consequently, successful synthesis of poly(amide‐imide)s is demonstrated which has wide applicability in the electronic industries due to their low glass transition temperature. It is expected that semiconductor and integrated circuit products can be manufactured utilizing poly(amide‐imide)s with high reliability and a low chance of cracking due to their lower residual stress. Furthermore, it envisioned that the improved optical properties of poly(amide‐imide) materials will allow for their applications in transparent displays and coating products.