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Decomposition Kinetics, Life Estimation, and Dielectric Study of an Acrylate based Photopolymer for Microfabrication and Photonic Applications
Author(s) -
Nguyen Le Huong,
Gu Min
Publication year - 2005
Publication title -
macromolecular chemistry and physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.57
H-Index - 112
eISSN - 1521-3935
pISSN - 1022-1352
DOI - 10.1002/macp.200500136
Subject(s) - microfabrication , materials science , thermogravimetric analysis , thermal decomposition , dielectric , microelectronics , photopolymer , curing (chemistry) , activation energy , acrylate , decomposition , kinetics , fabrication , polymer chemistry , composite material , optoelectronics , chemistry , polymerization , polymer , organic chemistry , copolymer , medicine , alternative medicine , physics , pathology , quantum mechanics
Summary: Kinetics of thermal decomposition of the acrylate‐based photopolymer LN1 for microfabrication was studied with dynamic thermogravimetric analysis experiments. The kinetic parameters including the activation energy, pre‐exponential factor, and rate constant, which were calculated by the Flynn and Wall method, are presented. The results indicate that thermal degradation of the material consists of three distinct reaction stages. A mechanism of thermal decomposition was proposed, which is in good agreement with the experimental results. The lifetime of the material was estimated by the method of Toop, giving the key information for microelectronics and photonic applications. In addition, the curing behavior of the system was studied by dielectric analysis providing valuable information for processing and fabrication control.Conversion time versus temperature (a), percentage conversion versus time (b).