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Morphological Studies of Epoxy/Polyaniline Blends
Author(s) -
Tsotra Panayota,
Gryshchuk Oleg,
Friedrich Klaus
Publication year - 2005
Publication title -
macromolecular chemistry and physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.57
H-Index - 112
eISSN - 1521-3935
pISSN - 1022-1352
DOI - 10.1002/macp.200400504
Subject(s) - polyaniline , conductive polymer , materials science , scanning electron microscope , epoxy , percolation threshold , differential scanning calorimetry , dynamic mechanical analysis , polymer chemistry , composite material , thermal stability , polymer blend , chemical engineering , polymer , electrical resistivity and conductivity , copolymer , polymerization , physics , engineering , electrical engineering , thermodynamics
Summary: Polyaniline‐dodecybenzenesulfonic acid (PANI‐DBSA)/epoxy resin (EP) blends were prepared by a solution‐in‐toluene process and direct mixing of PANI‐DBSA with EP. The dispersion quality of PANI‐DBSA proved to be strongly related to the final electrical properties of the cured blends. The solution processed blends showed enhanced electrical properties with small PANI‐DBSA contents (percolation threshold determined was around 2.3 wt.‐% PANI‐DBSA). The morphologies of these blends were investigated by atomic force (AFM), scanning electron (SEM) and transmission electron (TEM) microscopy. The existence of a translucent PANI‐DBSA network exists within the EP matrix. The microscopy investigations were in agreement with the results from differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA).SEM image of the PANI‐DBSA‐rich regions (indicated by arrows) surrounded by the conductive EP/PANI‐DBSA matrix (5 wt.‐% PANI‐DBSA).