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Stress corrosion cracking of copper in swollen bentonite simulating nuclear waste disposal environment
Author(s) -
Fujimoto Shinji,
Tsuchiya Hiroaki,
Ogawa Soma,
Iida Yoshihisa,
Taniguchi Naoki
Publication year - 2021
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.202011878
Subject(s) - bentonite , copper , materials science , tarnish , metallurgy , corrosion , dissolution , stress corrosion cracking , oxide , aqueous solution , cracking , strain rate , composite material , chemistry , geology , geotechnical engineering
Abstract Stress corrosion cracking (SCC) of pure copper in bentonite clay was examined using a slow strain rate test (SSRT). Bentonite was swollen with pure water or aqueous solutions containing NH 3 of 5 and 10 mM. Thick corrosion films and particulate deposits were formed on the copper surface after the SSRT. Typical tarnish rupture‐type SCC occurred on pure copper in swollen bentonite with and without NH 3 . The crack propagation rate was enhanced by NH 3 . It is confirmed that a thick oxide layer was formed on copper during plastic deformation, resulting in tarnish crack‐type SCC. Many particulate deposits observed on the surface were formed due to the rapid dissolution of Cu 2+ ions to form porous CuO at local deformed sites, regardless of the SCC occurrence.