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Complementary EIS/FTIR study of the degradation of adhesives in electronic packaging
Author(s) -
Schneider Michael,
Gierth Uta,
Simunkova Lenka,
Gierth Paul,
Rebenklau Lars
Publication year - 2020
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.202011772
Subject(s) - adhesive , epoxy , fourier transform infrared spectroscopy , electronic packaging , degradation (telecommunications) , materials science , dielectric spectroscopy , reliability (semiconductor) , electronics , electronic equipment , composite material , computer science , reliability engineering , electrochemistry , chemical engineering , chemistry , engineering , computer hardware , telecommunications , power (physics) , physics , electrode , layer (electronics) , quantum mechanics
Adhesives are widely used in electronic packaging and are of vital importance in the reliability of electronic systems. A deep understanding of the degradation mechanism of adhesives under corrosion load plays a key role in lifetime prediction. Unfortunately, most of the common reliability tests are destructive. The present approach combines the nondestructive methods, electrochemical impedance spectroscopy and the Fourier‐transform infrared spectroscopy, as powerful tools in a complementary manner to describe the degradation mechanism and kinetics of two epoxy‐based adhesives, which are commonly used in electronic packaging. It is demonstrated that the application quality is the dominating impact on the optimization of the lifetime.