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Effect of relative humidity on the corrosion behavior of Sn–0.7Cu solder under polyvinyl chloride fire smoke atmosphere
Author(s) -
Li Qian,
Lin Jin,
Li Changhai,
Lu Shouxiang,
Chen Xiao
Publication year - 2020
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.202011604
Subject(s) - corrosion , relative humidity , materials science , metallurgy , microstructure , electrolyte , chloride , degree (music) , oxygen , diffusion , chemistry , electrode , meteorology , physics , organic chemistry , acoustics , thermodynamics
The effect of environment relative humidity (RH) on the corrosion behavior of Sn–0.7Cu solder was investigated by the weight loss method and surface characterization techniques. In this study, RH ranging from 50% to 98% was researched. The results show that the corrosion degree is getting worse from 50% RH to 90% RH. However, the corrosion rate at 98% RH is lower than that at 90% RH, which may be ascribed to the degree of oxygen diffusion in electrolyte layers of different thicknesses. The microstructure characterization proved that the corrosion products exhibit a superimposed growth and present the same corrosion degree variation trend as the corrosion kinetics. The compositions of corrosion products are examined, and Sn 21 Cl 16 (OH) 14 O 6 , SnO, and SnO 2 are the main corrosion products.