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Effects of Sn in α‐Mg matrix on properties of surface films of Mg‐xSn (x = 0, 2, 5 wt%) alloys
Author(s) -
Yang J.,
Yim C. D.,
You B. S.
Publication year - 2016
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.201508585
Subject(s) - tin , magnesium , x ray photoelectron spectroscopy , materials science , tin oxide , metal , chloride , adsorption , electrochemistry , inorganic chemistry , oxide , metallurgy , analytical chemistry (journal) , chemical engineering , chemistry , electrode , chromatography , engineering
In this study, the effects of solid tin dissolved in the α‐magnesium matrix of magnesium‐tin alloys on the characteristics of surface films of the alloys were investigated using immersion and electrochemical tests, which were performed in a sodium chloride solution. The macroscopic in‐situ and anodic potentiostatic tests showed that the breakdown resistance of the surface films could be arranged in the following order: pure magnesium < Mg‐2Sn < Mg‐5Sn. The surface films of the studied materials exhibited n‐type semiconductor characteristics, and their defect (donor) density decreased with an increase in the tin content. The results of X‐ray photoelectron spectroscopy analysis indicated that the metallic tin as well as small amounts of tin oxide were incorporated in the middle layer of the surface films of the magnesium‐tin alloys. The decrease in the defect density of the surface films is attributable to a change in their composition, which probably prevented the adsorption of aggressive chloride ions and improved the protection afforded by the films.